Introduction Terminal Plating Most electronic connectors and terminals undergo a surface treatment, generally called electroplating. There are two main reasons: one is to protect the terminal spring base material from corrosion, and the other is to optimize the terminal surface properties and establish and maintain the contact interface between terminals, especially film control. In other words, making metal-to-metal contact easier to achieve. Anti-corrosion: Most connector reeds are made of copper alloy, which will generally cause corrosion in the use environment, such as oxidation, sulfurization, etc. Terminal plating is to isolate the reed from the environment and prevent corrosion. Of course, plating materials are non-corrosive, at least in the application environment. Terminal surface performance optimization can be achieved in two ways. One is that the connector is designed to establish and maintain a stable terminal contact interface. The second is to create a metal contact that requires insertion of any surface layer that is not present or will break. The two different forms of plating, precious metal plating and non-precious metal plating, have no thin film or film cracks. Plating of precious metals such as gold, palladium and their alloys is inert and does not have its own film. Therefore, for these surface treatments, metal contact is "automatic". We need to consider external factors such as contamination, matrix diffusion, terminal corrosion, etc., and how to maintain the "nobility" of the terminal surface.
When needles are missing, an assembly process is required, and needle shortages often occur. Flatness is not up to standard. Smt chip is one of the key processes in the circuit board end welding process. So when choosing SMT products, what you care about is the flatness. Once it is uneven, it needs to be repaired. The repair welding process is cumbersome and increases costs. In order to avoid the increase in cost, we can use machine tool fixtures to screen and adjust the straightness of the control fixture to 8-10 seconds. When the product passes through the fixture smoothly and enters the pipe, the straightness is qualified. When the product does not meet the requirements, the straightness is passed. , place it in the defective area for inspection and repair. figure 2. For products that cannot be detected by the main motor and cannot pass the fixture, CCD is used to analyze and test the flatness of the product. It is found that the flatness of the product entering the front end of the packaging connecting rod is not enough. The clamping force is an issue that cannot be ignored during the pin row performance test. Problems such as insufficient clamping force between the pin bar and the terminal are not easy to find when welding the printed circuit board. When the pin bar is inserted after the welding is completed, the holding force is insufficient, causing the core bar to be completely discharged and the busbar terminals to remain on the board.
High-temperature plastics, commonly used plastic raw materials include pbt, pa6t, pa9t, and lcp. Pbt is suitable for wave soldering, pa6t, pa9t, lcp and other wave soldering, wave soldering and reflow soldering. Smt products must use reflow soldering, so customers must understand the customer's processing technology when querying samples. Even with high-temperature-resistant materials, the rubber core can deform and blister as it passes through the furnace. One of the reasons is that PA6T, PA9T and LCP materials cannot be used within two or three months after production. Therefore, plastic raw materials do not need to be baked and reflowed again when stored for 1 to 3 months to determine whether they are deformed. After foaming, the hair is produced normally.